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J. Z. Li, P. Shrivastava and Z. Gao, “Printed Circuit Board Recycling: A State-of-the-Art Survey,” Proceeding of the 2002 IEEE International Symposium on Electronics and the Environment, Vol. 27, 2004, pp. 234-241.

has been cited by the following article:

• TITLE: Analysis of Mobile Phone Reliability Based on Active Disassembly Using Smart Materials

  AUTHORS: Zhifeng Liu, Liuxian Zhao, Jun Zhong, Xinyu Li, Huanbo Cheng

  KEYWORDS: Active Disassembly, Mobile Phone, Environmental Reliability, Analysis of Collision, Analysis of Vibration

  JOURNAL NAME: Journal of Surface Engineered Materials and Advanced Technology, Vol.1 No.2, July 21, 2011

  ABSTRACT: When using shape memory materials into active disassembly of actual electronic products, because the elastic modulus of shape memory materials is affected by the temperature is relatively large, therefore, the main difference of environmental reliability between active disassembly products and common products is the impact of collision and vibration under different temperature. Establishing three-dimensional analysis model, comparing the impact of collision and vibration of mobile phone shells which are made up of PVC materials after casting & radiation and PC/ABS materials under different temperature. Analyzing the reliability of mobile phone under different temperature and optimizing its structure according to data of testing.