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Li, M.Y., Xu, H.B., Lee, S.-W.R., Jongmyung, K. and Daewon, K. (2008) Eddy Current Induced Heating for the Solder Reflow of Area Array Packages. IEEE Transactions on Advanced Packaging, 31, 399-403.
http://dx.doi.org/10.1109/TADVP.2008.923385

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