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Suganuma, K., Baated, A., Kim, K.S., Hamasaki, K., Nemoto, N., Nakagawa, T. and Yamada, T. (2011) Sn Whisker Growth during Thermal Cycling. Acta Materialia, 59, 7255-7267.
http://dx.doi.org/10.1016/j.actamat.2011.08.017

has been cited by the following article:

• TITLE: Effect of Environmental Conditions on Tin (Sn) Whisker Growth

  AUTHORS: Heshmat A. Aglan, Kaushal R. Prayakarao, Md. Karim Rahman, David V. Burdick

  KEYWORDS: Tin Whisker, Environmental Conditions, Tin Coated Brass Coupons, Whisker Growth, Corrosion

  JOURNAL NAME: Engineering, Vol.7 No.12, December 21, 2015

  ABSTRACT: This research focuses on tin whisker growth under two different environmental conditions namely hygrothermal and a salt solution. Tin coated brass coupons were used for this study to analyze the growth of tin whiskers over time. Their growth rates were examined periodically using optical and scanning electron microscopy. The physical characteristics of the tin whiskers were identified for each environmental condition. It was discovered that submersion of tin coated brass substrates in 5% salt solution considerably increased the density (number of whiskers per unit area), and the length of the whiskers. In addition, it was found that the geometry and aspect ratio of tin whiskers were different for each environment.