TITLE:
Optimization of the Implementation Process and Physical Properties of Cotton ( Gossipium hirsutum ) and Kenaf ( Hibiscus cannabinus L.) Wooden Chipboard
AUTHORS:
Sagnaba Soulama, Kokou Esso Atcholi, Bétaboalé Naon, Komi Kadja, Komla Sanda
KEYWORDS:
Chipboard, Cotton Wood, Kenaf Wood, Bone Glue, Mechanical Properties
JOURNAL NAME:
Engineering,
Vol.7 No.12,
December
21,
2015
ABSTRACT: The present study aims at valorizing two residues types of the foodless vegetable biomass which are abundant and very pollutant in Burkina Faso. To do it, first we try to identify the optimal values of chipboard elaboration parameters with kenaf and cotton stems by using a natural binder (the bone glue). Next we proceed to the elaboration of two panels types with optimized elaboration parameters. Besides we determine mechanical and thermal characteristics of elaborated panels with a view of an indoor thermal insulation application. Also it becomes necessary for us to determine by experimenting the thermal conductivity, Young’s modulus, Coulomb’s modulus, and the water inflation rate, taking into account some elaboration parameters on one hand and the correlation between mechanical and thermal properties on the other hand. Finally, the obtained results are compared with the panels properties values required by ANSI A 208.1-1999 standard.