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Shirangi, M.H. and Michel, B. (2010) Mechanism of Moisture Diffusion, Hygroscopic Swelling, and Adhesion Degradation in Epoxy Molding Compounds. Moisture Sensitivity of Plastic Packages of IC Devices, Springer, 29-69.
http://dx.doi.org/10.1007/978-1-4419-5719-1_2

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