TITLE:
Thermal and Electrical Properties of Sn-Zn-Bi Ternary Soldering Alloys
AUTHORS:
M. A. Wadud, M. A. Gafur, M. R. Qadir, M. O. Rahman
KEYWORDS:
Lead Free Solder Alloy, Eutectic Alloy, DTA, TMA, Conductivity
JOURNAL NAME:
Materials Sciences and Applications,
Vol.6 No.11,
November
20,
2015
ABSTRACT: Sn-Zn based solder is a possible replacement of Pb solder because of its better mechanical properties. The alloys need to be studied and explored to get a usable solder alloy having better properties. In this work, eutectic Sn-9Zn and three Tin-Zinc-Bismuth ternary alloys were prepared and investigated their thermal and electrical properties. Thermo-mechanical Analysis and Differential Thermal Analysis were used to investigate thermal properties. Microstructural study is carried out with Scanning Electron Microscope. The alloys have single melting point. The co-efficient of thermal expansion and co-efficient of thermal contraction varies with alloy composition and temperature range. Electrical conductivity changes with Bi addition.