Article citationsMore>>

Wen, H., Gomella, A.A., Patel, A., Lynch, S.K., Morgan, N.Y., Anderson, S.A., Bennett, E.E., Xiao, X.H., Liu, C. and Wolfe, D.E. (2013) Subnanoradian X-Ray Phase-Contrast Using a Far-Field Interferometer of Nanometric Phase Gratings. Nature Communications, 4, Article No. 2659.
http://dx.doi.org/10.1038/ncomms3659

has been cited by the following article:

• TITLE: Electrodeposition of Gold to Conformally Fill High-Aspect-Ratio Nanometric Silicon Grating Trenches: A Comparison of Pulsed and Direct Current Protocols

  AUTHORS: Sami Znati, Nicholas Chedid, Houxun Miao, Lei Chen, Eric E. Bennett, Han Wen

  KEYWORDS: Pulsed Electroplating, Gold Electroplating, High Aspect Ratio Trenches, Gold Electrodepostion, Di-rect Current Electrodeposition, Pulsed vs. Direct Current Electroplating, Atomic Layer Deposition Platinum Seed Layer, Silicon Trench Gratings, Trench Filling, Grating Filling, ALD Adhesive Layer

  JOURNAL NAME: Journal of Surface Engineered Materials and Advanced Technology, Vol.5 No.4, October 16, 2015

  ABSTRACT: Filling high-aspect-ratio trenches with gold is a frequent requirement in the fabrication of X-ray optics as well as micro-electronic components and other fabrication processes. Conformal electrodeposition of gold in sub-micron-width silicon trenches with an aspect ratio greater than 35 over a grating area of several square centimeters is challenging and has not been described in the literature previously. A comparison of pulsed plating and constant current plating led to a gold electroplating protocol that reliably filled trenches for such structures.