TITLE:
Effect of Bismuth Addition on Structure and Mechanical Properties of Tin-9Zinc Soldering Alloy
AUTHORS:
Muhommad Abdul Wadud, M. A. Gafur, Md. Rakibul Qadir, Mohammad Obaidur Rahman
KEYWORDS:
Lead Free Solder Alloy, Eutectic Alloy, Microhardness
JOURNAL NAME:
Materials Sciences and Applications,
Vol.6 No.9,
September
16,
2015
ABSTRACT: Sn-Zn based solder is a possible replacement of Pb solder because of its better mechanical properties. The alloys need to be studied and explored to get a usable solder alloy having better properties. In this work eutectic Sn-9Zn and three Tin-Zinc-Bismuth ternary alloys were prepared and investigated their microhardness and mechanical properties. Microhardness, tensile strength and elastic modulus increase with Bi addition while ductility decreases with Bi addition.