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Matahir, M., Chin, L.T., Tan, K.S. and Olofinjana, A.O. (2011) Mechanical Strength and It’s Variability in Bi-Mod-ified Sn-Ag-Cu Solder Alloy. Journal of Achievements in Materials and Manufacturing Engineering, 46, 50-56.

has been cited by the following article:

• TITLE: Effect of Bismuth Addition on Structure and Mechanical Properties of Tin-9Zinc Soldering Alloy

  AUTHORS: Muhommad Abdul Wadud, M. A. Gafur, Md. Rakibul Qadir, Mohammad Obaidur Rahman

  KEYWORDS: Lead Free Solder Alloy, Eutectic Alloy, Microhardness

  JOURNAL NAME: Materials Sciences and Applications, Vol.6 No.9, September 16, 2015

  ABSTRACT: Sn-Zn based solder is a possible replacement of Pb solder because of its better mechanical properties. The alloys need to be studied and explored to get a usable solder alloy having better properties. In this work eutectic Sn-9Zn and three Tin-Zinc-Bismuth ternary alloys were prepared and investigated their microhardness and mechanical properties. Microhardness, tensile strength and elastic modulus increase with Bi addition while ductility decreases with Bi addition.