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Awaya, N., Inokawa, H., Yamamoto, E., Okazaki, Y., Miyake, M., Arita, Y. and Kobayashi, T. (1996) Evaluation of a Copper Metallization Process and the Electrical Characteristics of Copper-Interconnected Quarter-Micron CMOS. IEEE Transactions on Electron Devices, 43, 1206-1212.
http://dx.doi.org/10.1109/16.506770

has been cited by the following article:

• TITLE: Dielectric Properties and a.c. Conductivity of Epoxy/Alumina Silicate NGK Composites

  AUTHORS: Waleed A. Hussain, Abdullah A. Hussein, Jabar M. Khalaf, Ali H. Al-Mowali, Abdullwahab A. Sultan

  KEYWORDS: Polymer-Matrix Composites, Dielectric Properties, Epoxy, Alumina Silicate

  JOURNAL NAME: Advances in Chemical Engineering and Science, Vol.5 No.3, June 30, 2015

  ABSTRACT: Alumina silicate powder which is extracted from the obsolete spark plug NGK (insulator part as a filler) has been used to produce epoxy/alumina silicate composite. The dielectric behavior of the composite materials (epoxy resin-alumina silicate NGK) is analyzed as a function of the filler content, temperature and frequency. AC conductivity and impedance are also studied. The results show that the permittivity, dielectric loss and loss tangent for all composites increase with increasing alumina silicate NGK filler content.