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Fontanelli, “System-in-Package Technology: Opportunities and Challenges,” IEEE 9th International Symposium on Quality Electronic Design, 2008, pp. 589-593.

has been cited by the following article:

• TITLE: Simplified Model of a Layer of Interconnects under a Spiral Inductor

  AUTHORS: Sonia M. Holik, Timothy D. Drysdale

  KEYWORDS: Effective Medium Theory, Interconnects, Spiral Inductor

  JOURNAL NAME: Journal of Electromagnetic Analysis and Applications, Vol.3 No.6, June 23, 2011

  ABSTRACT: An empirical effective medium approximation that provides a homogeneous equivalent for a layer of interconnects un-derneath a spiral inductor is presented. When used as part of a numerical 3D model of the inductor, this approach yields a faster simulation that uses less memory, yet still predicts the quality factor and inductance to within 1%. We expect this technique to find use in the electromagnetic modeling of System-on-Chip.