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Humphrey, J.A.C., Devarakonda, R. and Queipo, N. (1993) Interactive Computational-Experimental Methodologies (ICEME) for Thermofluids Research: Application to the Optimized Packaging of Heated Electronic Components. In: Yang, K.T. and Nakayama, W., Eds., Computers and Computing in Heat Transfer Science and Engineering, CRC Press and Begell House, New York, 293-317.

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