TITLE:
Augmenting the Heat Sink for Better Heat Dissipation
AUTHORS:
Mohammed H. S. Al Ashry
KEYWORDS:
Convective Heat Transfer: Heat Absorbed by the Natural Air Flow Surrounding Hot Objects, Forced Convective Heat Transfer: Absorption of Heat Using Forced Air Flow, Conductivity: Is the Ability of a System to Exchange or Transfer Temperature within a Body or Material through the Movement of Electrons, Material That Does Not Conduct Heat Is Considered a Nonconductor
JOURNAL NAME:
Circuits and Systems,
Vol.6 No.2,
February
15,
2015
ABSTRACT: Heat
sinks were invented to absorb heat from an electronic circuit conduct, and then
to dissipate or radiate this heat to the surrounding supposedly, ventilated
space, at a rate equal to or faster than that of its buildup. Ventilation was
not initially recognized as an essential factor to thermal dispersion. However,
as electronic circuit-boards continued to heat up, circuit failure became a problem,
forcing the inclusion of miniaturized high speed fans. Later, heat sinks with
fins and quiet fans were incorporated in most manufactured circuits. Now heat
sinks come in the form of a fan with fans made to function as fins to disperse
heat. Heat sinks absorb and radiate excess heat from circuit-boards in order to
prolong the circuit’s life span. The higher the thermal conductivity of the
material used the more efficient and effective the heat sink is. This paper is
an attempt to theoretically design a heat sink with a temperature gradient
lower than that of the circuit board’s excess heat.