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Leslie, B. and Matta, F. (1989) Wafer-Level Testing with a Membrane Probe. IEEE Design & Test of Computers, 6, 10-17.

has been cited by the following article:

• TITLE: A Study of Design Optimization Using Response Surface Analysis and Fabricaiton MEMS Probe Tip

  AUTHORS: K. B. Kim, J. W. Lee, S. J. Ha, Y. K. Cho, M. W. Cho

  KEYWORDS: A Study of Design Optimization Using Response Surface Analysis and Fabricaiton MEMS Probe Tip

  JOURNAL NAME: Journal of Applied Mathematics and Physics, Vol.3 No.2, January 30, 2015

  ABSTRACT: In semiconductor manufacturing process, probe station that is testing equipment is important. Inspection step is for detecting defects on semiconductor before the packaging. Probe card is a part of probe station and contains probe tip that contacts to semiconductor. Through probe tip, it can inspect defects of semiconductor. In this paper, optimization method is used with response surface analysis to design MEMS type probe tip. And fabricating probe tip uses maskless lithography, electro-plating and lapping process.