Article citationsMore>>

Lee, M.C.M., and Wu, M.C. (2006) Thermal Annealing in Hydrogen for 3-D Profile Transformation on Silicon-on- Insulator and Sidewall Roughness Reduction. Journal of Microelectromechanical Systems, 15, 338-343.
http://dx.doi.org/10.1109/JMEMS.2005.859092

has been cited by the following article:

SCIRP Newsletter
Copyright © 2006-2026 Scientific Research Publishing Inc. All Rights Reserved.
Top