Article citationsMore>>

S. Kozakai, N. Ichiroku, A. Suzuki and T. Shiobara, “Adhesive Composition and Adhesive Film,” United States Patent No. 7364797, Shin-Etsu Chemical Co., Ltd., Tokyo, Japan, 29 April 2008.

has been cited by the following article:

• TITLE: Optimization in Autoclave Process to Produce Durable Aluminium Composite

  AUTHORS: Handoko Subawi

  KEYWORDS: Aluminium Composite, Adhesive Bonding, Failure Mode, Cohesive Failure

  JOURNAL NAME: Materials Sciences and Applications, Vol.2 No.5, May 23, 2011

  ABSTRACT: The purpose of this paper is to characterize adhesive bonding performance through the fracture evaluation. Failure modes correlate to the bond strength, in which the weak bond of adhesion will be considered unacceptable in the aircraft manufacture certification, whereas the cohesion bond as strong as adhesive itself is preferably accepted. The final quality of adhesive bonding process depends on several key variables during manufacturing. A good anodizing treatment is properly maintained in order to eliminate possible bond failures in the long term bond durability in service. This paper described the method to improve an adhesive joining for durable bonds through optimizing the process variable during autoclave curing. The process simulation utilized the drum peel test to describe the cohesive fracture phenomenon in which applicable on a daily load basis in commercial application.