TITLE:
Transfer of Machined Patterns on an Aluminum Plate to Pyrex Glass Using Reactive Ion Etching SF6 Plasma without Masks
AUTHORS:
Carlos M. Ortiz-Lima, Fernando J. Quiñones-Novelo, Alberto Jaramillo-Núñez, Jorge Castro-Ramos
KEYWORDS:
Reactive Ion Etching, No Masking RIE, SF6, Plasma Etching
JOURNAL NAME:
Journal of Surface Engineered Materials and Advanced Technology,
Vol.4 No.5,
August
13,
2014
ABSTRACT: A method for
etching the surface of a Pyrex glass substrate using the Reactive Ion Etching
process without the use of masks is reported. Variations in the machined
surface on an auxiliary plate, manufactured in aluminum and placed below a
Pyrex glass slide, were transferred to the upper surface of the substrate. SF6 as etching gas and low pressure chamber to promote the increase of mean free
path of ions were used. Two etching ratios were found, general, that affects
the entire surface of the substrate, and differential, which generates the
relief on the surface of the glass. Differential etching depth showed a linear
behavior with respect to time; the mean differential etching rate obtained was
43 nm/min. The same phase between the auxiliary plate machining and the etched
pattern on the substrate is preserved. With this technique it was possible to
manufacture convex and concave surfaces; some examples are given. The
arithmetic mean roughness achieved with the proposed method was found to be N1
class, ideal for the development of optical corrector plates.