Article citationsMore>>

Ruder, A. and Itzahk, D. (1982) Titanium Deposition on to Copper Substrates Using the Cold Plasma Technique. Thin Solid Films, 97, 339-343. http://dx.doi.org/10.1016/0040-6090(82)90526-0

has been cited by the following article:

SCIRP Newsletter
Copyright © 2006-2026 Scientific Research Publishing Inc. All Rights Reserved.
Top