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I. Zubel and M. Kramkowska, “Etch Rates and Morphology of Silicon (h k l) Surfaces Etched in KOH and KOH Saturated with Isopropanol Solutions,” Sensors and Actuators A: Physical, Vol. 115, No. 2-3, 2004, pp. 549-556.
http://dx.doi.org/10.1016/j.sna.2003.11.010

has been cited by the following article:

• TITLE: Online Process Control of Alkaline Texturing Baths: Determination of the Chemical Concentrations

  AUTHORS: Martin Zimmer, Katrin Krieg, Jochen Rentsch

  KEYWORDS: Alkaline Texturisation; Titration; High Performance Liquid Chromatography (HPLC); Surface Tension Measurement; Near-Infrared Spectroscopy (NIR); Silicon Solar Cell Manufacturing

  JOURNAL NAME: American Journal of Analytical Chemistry, Vol.5 No.3, February 26, 2014

  ABSTRACT: Almost every monocrystalline silicon solar cell design includes a wet chemical process step for the alkaline texturing of the wafer surface in order to reduce the reflection of the front side. The alkaline texturing solution contains hydroxide, an organic additive usually 2-propanol and as a reaction product silicate. The hydroxide is consumed due to the reaction whereas 2-propanol evaporates during the process. Therefore, the correct replenishment for both components is required in order to achieve constant processing conditions. This may be simplified by using analytical methods for controlling the main components of the alkaline bath. This study gives an overview for a successful analytical method of the main components of an alkaline texturing bath by titration, HPLC, surface tension and NIR spectrometry.