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G. A. Hope, G. M. Brown, D. P. Schweinsberg, K. Shimizu and K. Ko-bayashi, “Observations of Inclusions of Polymeric Addi-tives in Copper Electrodeposits by Trans- mission Electron Microscopy,” Journal of Applied Electrochemistry, Vol. 25, No. 9, 1995, pp. 890-894. doi:10.1007/BF00772211

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