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S. J. Park, H. J. Sohn, S. K. Hong and G. S. Shin, “Influence of Atmospheric Fluorine Plasma Treatment on Thermal and Dielectric Properties of Polyimide Film,” Journal of Colloid and Interface Science, Vol. 332, No. 1, 2009, pp. 246-250.
http://dx.doi.org/10.1016/j.jcis.2008.12.040

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