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A. Altes, R. Tilgner and W. Walter, “Numerical Evaluation of Miniaturized Resistive Probe for Quantitative Thermal Near-Field Microscopy of Thermal Conductivity,” Microelectronics Reliability, Vol. 46, No. 9-11, 2006, pp. 1525-1529. doi:10.1016/j.microrel.2006.07.030

has been cited by the following article:

• TITLE: Finite Element Analysis of the Material’s Area Affected during a Micro Thermal Analysis Applied to Homogeneous Materials

  AUTHORS: Yoann Joliff, Lénaïk Belec, Jean-François Chailan

  KEYWORDS: Micro-Thermal Analysis, Localized Thermal Analysis, Heat Affected Zone, Thermal Conductivity, Finite Element Method

  JOURNAL NAME: Journal of Surface Engineered Materials and Advanced Technology, Vol.1 No.1, March 17, 2011

  ABSTRACT: Micro-thermal analysis (µ-TA), with a miniaturized thermo-resistive probe, allows topographic and thermal imaging of surfaces to be carried out and permits localized thermal analysis of materials. In order to estimate the effective volume of material thermally affected during this localized measurement, simulations, using finite element method were used. Several parameters and conditions were considered. So, thermal conductivity was found to be the driving physical parameter in thermal exchanges. Indeed, the evolution of the heat affected zone (HAZ) versus thermal conductivity can well be described by a linear interpolation. Therefore it is possible to estimate the HAZ before experimental measurements. This result is an important progress especially for accurate interphase characterization in heterogeneous materials.