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H. Otmacic, J. Telegdi, K. Papp and E. Stupnisek-Usac, “Protective Properties of an Inhibitor Layer Formed on Copper in Neutral Chloride Solution,” Journal of Applied Electrochemistry, Vol. 34, No. 5, 2004, pp. 545-550. doi:10.1023/B:JACH.0000021873.30314.eb

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