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B. Kim, R. Candler, R. Melamud, M. Hopcraft, S. Yoneoka, H. Lee, M. Agarwal, S. Chanorkar, G. Yama and T. Kenny, “Hermeticity and Diffusion Investigation in Poly-silicon Film Encapsulation for MEMS,” Journal of Applied Physics, Vol. 105, 2009, Article ID: 013514. http://dx.doi.org/10.1063/1.3054366

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