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H. Henmi, S. Shoji, Y. Shoji, K. Yoshimi and M. Esashi, “Vacuum Packaging for Microsensors by Glass-Silicon Anodic Bonding,” Sensors and Actuators A, Vol. 43, 1994, pp. 243-250. http://dx.doi.org/10.1016/0924-4247(94)80003-0

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