Balancing Thermal and Electrical Packaging Requirements for GaN Microwave and Millimeter-Wave High Power Amplifier Modules

ISSN Print: 2162-6162
ISSN Online: 2162-6170
www.scirp.net/journal/jectc
E-mail: [email protected]

Citations

"Balancing Thermal and Electrical Packaging Requirements for GaN Microwave and Millimeter-Wave High Power Amplifier Modules"
written by Rick Sturdivant, Astacian Bogdon, Edwin K. P. Chong,
published by Journal of Electronics Cooling and Thermal Control, Vol.7 No.1, 2017

has been cited by the following article(s):

[1]	Machine Learning‐Based Solution for Thermomechanical Analysis of MMIC Packaging
	Advanced Materials …, 2022

[2]	Optimization of the composition in a composite material for microelectronics application using the Ising model
	2021

[3]	Experimental study on characteristics of gravity heat pipe with threaded evaporator
	Thermal Science and …, 2021

[4]	Optimization techniques for analog and RF circuit designs: an overview
	2020

[1]	Machine Learning‐Based Solution for Thermomechanical Analysis of MMIC Packaging Advanced Materials Technologies, 2022 DOI:10.1002/admt.202201479

[2]	Experimental study on characteristics of gravity heat pipe with threaded evaporator Thermal Science and Engineering Progress, 2021 DOI:10.1016/j.tsep.2021.101107

[3]	Optimization techniques for analog and RF circuit designs: an overview Analog Integrated Circuits and Signal Processing, 2021 DOI:10.1007/s10470-020-01733-7

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