|
[1]
|
Additive Manufactured Millimeter-Wave Power Amplifier Package With Embedded Heat Spreader
IEEE Transactions on Components, Packaging and Manufacturing Technology,
2026
DOI:10.1109/TCPMT.2026.3712201
|
|
|
|
|
[2]
|
Thermal analysis of a novel fan-out packaging structure optimized with graphene
Engineering Research Express,
2025
DOI:10.1088/2631-8695/ade4f1
|
|
|
|
|
[3]
|
Methods for Calculating the Resistance of Bulk Conductors with a Small Area of Electrical Contacts
Russian Electrical Engineering,
2024
DOI:10.3103/S1068371224700093
|
|
|
|
|
[4]
|
Chip Size Minimization for Wide and Ultrawide Bandgap Power Devices
IEEE Transactions on Electron Devices,
2023
DOI:10.1109/TED.2022.3232309
|
|
|
|
|
[5]
|
Thermal Circuit Models of Microstrip Lines Based on Precise Heat Spreading Angles and Convection Boundary Conditions
IEEE Transactions on Components, Packaging and Manufacturing Technology,
2023
DOI:10.1109/TCPMT.2023.3255870
|
|
|
|
|
[6]
|
Thermal design for the package of high-power single-emitter laser diodes
Optics & Laser Technology,
2020
DOI:10.1016/j.optlastec.2020.106266
|
|
|
|
|
[7]
|
Three-dimensional thermal model of a high-power diode laser bar
Applied Optics,
2018
DOI:10.1364/AO.57.009868
|
|
|
|
|
[8]
|
Heat spreading revisited – effective heat spreading angle
2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM),
2015
DOI:10.1109/SEMI-THERM.2015.7100145
|
|
|
|
|
[9]
|
Thermal management of a low-cost 2kW solar inverter
2014 16th European Conference on Power Electronics and Applications,
2014
DOI:10.1109/EPE.2014.6911026
|
|
|
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