has been cited by the following article(s):
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[1]
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Design, preparation, and double-mechanism strengthening effect analysis of Sn-Zn-Al-Pt solder alloy with high service performance
Materials Science and Engineering: A,
2025
DOI:10.1016/j.msea.2024.147755
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[2]
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Aluminum-Affecting Solidification Behavior, Microstructure, and Tensile Properties in Tin–Zinc Eutectic Alloy
ACS Omega,
2025
DOI:10.1021/acsomega.4c08359
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[3]
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Effect of Ce and Cr Additions on the Physical and Mechanical
Properties of Materials of Sn-9Zn Solder Alloy
SAE International Journal of Materials and Manufacturing,
2025
DOI:10.4271/05-19-02-0009
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[4]
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Production and computational investigation of high entropy solder alloy
Journal of Materials Science: Materials in Electronics,
2025
DOI:10.1007/s10854-025-15540-1
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[5]
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The role of Sb on the microstructure and creep behaviors of Sn–6.5Zn–0.3Cu Pb-free solder alloy
Journal of Materials Science: Materials in Electronics,
2024
DOI:10.1007/s10854-024-13421-7
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[6]
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Hydrazine electrooxidation activities of novel carbon nanotube supported Tin modified Palladium nanocatalysts
Surfaces and Interfaces,
2022
DOI:10.1016/j.surfin.2021.101680
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[7]
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Effect of Zn incorporation on the electrochemical corrosion properties of SAC105 solder alloys
Journal of Materials Science: Materials in Electronics,
2019
DOI:10.1007/s10854-019-01055-z
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[8]
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Enhanced Microstructural, Thermal and Tensile Characteristics of Heat Treated Sn-5.0Sb-0.3Cu (SSC-503) Pb-free Solder Alloy under High Pressure
Materials Science and Engineering: A,
2018
DOI:10.1016/j.msea.2018.11.137
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