Failure Analysis of Ceramic Substrates Used in High Power IGBT Modules

ISSN Print: 1947-3931
ISSN Online: 1947-394X
www.scirp.net/journal/eng
E-mail: [email protected]

Citations

"Failure Analysis of Ceramic Substrates Used in High Power IGBT Modules"
written by Zenjebil Jouini, Zarel Valdez-Nava, David Malec,
published by Engineering, Vol.8 No.9, 2016

has been cited by the following article(s):

[1]	Contribution à l'interconnexion de composants actifs intégrés dans des substrats laminés: apport des interfaces micro ou nano-structurées
	2020

[2]	Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for IGBT power module
	2019

[3]	Effects of Particle Size of Al2O3 on the Mechanical Properties and Micro-Structures of Al2O3-3YSZ Composites
	2017

Top

[1]	Electric field enhancement of ceramics including microdefects Journal of the American Ceramic Society, 2025 DOI:10.1111/jace.20690

[2]	Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for IGBT power module Thermal Science and Engineering Progress, 2019 DOI:10.1016/j.tsep.2019.01.007