Study of Ni/Al Interface Diffusion by Molecular Dynamics Simulation

ISSN Print: 1947-3931
ISSN Online: 1947-394X
www.scirp.net/journal/eng
E-mail: [email protected]

Citations

"Study of Ni/Al Interface Diffusion by Molecular Dynamics Simulation"
written by Chunguang Zhang, Hao Wang, Yishen Qiu,
published by Engineering, Vol.3 No.3, 2011

has been cited by the following article(s):

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[2]	Mechanical behavior of Ni/Ti bilayer-based shape memory alloys: Endorsement via atomistic simulations
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[3]	Compaction simulation of nano-crystalline metals with molecular dynamics analysis
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[4]	Thermodynamic interpretation of reactive processes in Ni–Al nanolayers from atomistic simulations
	?Modelling and Simulation in Materials Science and Engineering, 2014

[1]	Review of Molecular Dynamics Simulation of Bimetallic Interfacial Behavior Materials, 2025 DOI:10.3390/ma18133048

[2]	Mechanical behavior of Ni/Ti bilayer-based shape memory alloys: Endorsement via atomistic simulations Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 2024 DOI:10.1177/09544089241241393

[3]	Si/InP direct wafer bonding: A first-principles study Computational Materials Science, 2024 DOI:10.1016/j.commatsci.2024.113061

[4]	Compaction simulation of nano-crystalline metals with molecular dynamics analysis MATEC Web of Conferences, 2016 DOI:10.1051/matecconf/20168002011