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[1]
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Intelligent Manufacturing in Industry 6.0
2026
DOI:10.1007/978-3-032-07278-8_10
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[2]
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Charge Assisted H Bonding and Semiconductivity in Cocrystal of Ethane‐1, 2‐diylbis(diphenylphosphine Oxide) and 2 Naphthol
ChemistrySelect,
2026
DOI:10.1002/slct.202506989
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[3]
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Formation of diamond trenches with flat {111} sidewalls via thermochemical etching by Ni films in water vapor
Applied Surface Science Advances,
2025
DOI:10.1016/j.apsadv.2025.100898
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[4]
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Characterization of Copper Leadframe for the Non Pressure Silver Sintering Process
2025 IEEE 27th Electronics Packaging Technology Conference (EPTC),
2025
DOI:10.1109/EPTC67330.2025.11392624
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[5]
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GaN-Based DC-DC converters for EV fast charging: A review of wide bandgap devices technology
Results in Engineering,
2025
DOI:10.1016/j.rineng.2025.107548
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[6]
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The Art of Noise Modeling and Mitigation on Power Line Communication in Distributed Energy System
IEEE Transactions on Instrumentation and Measurement,
2025
DOI:10.1109/TIM.2025.3552456
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[7]
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Verification of the Consistency of Thermal Resistance Measurement of Heat Source-Temperature Measurement Separated Chips
2025 4th International Conference on Electronics, Integrated Circuits and Communication Technology (EICCT),
2025
DOI:10.1109/EICCT65471.2025.11099809
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[8]
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Power Electronics for IoT-Enabled Smart Grids and Industrial Automation
SSRN Electronic Journal,
2025
DOI:10.2139/ssrn.5382142
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[9]
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Defect and electrical characteristics of 4H-SiC junction barrier Schottky diodes under high-energy electron irradiation at different fluences
Journal of Physics D: Applied Physics,
2025
DOI:10.1088/1361-6463/adfb89
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