Open Journal of Business and Management

Open Journal of Business and Management

ISSN Print: 2329-3284
ISSN Online: 2329-3292
www.scirp.net/journal/ojbm
E-mail: [email protected]
"Emerging Business Trends in the Microelectronics Industry"
written by Samar K. Saha,
published by Open Journal of Business and Management, Vol.4 No.1, 2016
has been cited by the following article(s):
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[2] Operating Efficiency in the Capital-Intensive Semiconductor Industry: A Nonparametric Frontier Approach
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[3] Development focus of electronics industry in Russia: Shift from defense sector to market
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[4] Design and analysis of asymmetrical low-k source side spacer halo doped nanowire metal oxide semiconductor field effect transistor
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[5] Design and analysis of a symmetrical Low-κ source-side spacer multi-gate Nanowire device
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[6] A detailed roadmap from conventional‐MOSFET to nanowire‐MOSFET
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[7] A Study on Emergence of Cryptocurrency in the Modern World
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[8] Current Drifts in Business and Finance
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[9] A composable design space exploration framework to optimize behavioral locking
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[10] Supporting Collaborative Innovation Processes in Smart Product Value Creation Networks
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[11] Comparative Analysis of the Development Status of Integrated Circuit Trade between China and South Korea
한중경제문화연구, 2022
[12] ТРАНСФОРМАЦИЯ БИЗНЕС-МОДЕЛЕЙ ЭЛЕКТРОНИКИ: ОТ IDM К ЭКОСИСТЕМАМ
Естественно-гуманитарные исследования, 2021
[13] The Impact of Technological Capability on Financial Performance in the Semiconductor Industry. Sustainability 2021, 13, 489
2021
[14] The Impact of Technological Capability on Financial Performance in the Semiconductor Industry
2021
[15] Composable Heuristics for Register-Transfer Level Logic Locking Optimization
2020
[16] Lead scratch resolution through wirebonding process optimization on qfn packages
2020
[17] FinFET Devices for VLSI Circuits and Systems
2020
[18] A Study of Die Shear Test Performance on Different Diebond Machine Platforms
2020
[19] Leadframe Design Enhancement for Elimination of Burrs at Singulation Process
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[20] Ball Misplace Mitigation through Process Optimization of Advanced Leadframe Package
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[21] Elimination of Smashed Ball Defect through Process and Design Improvement
2020
[22] Die Attach Machine Selection for Glue Voids Reduction Performance
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[23] Die Attach Film Bleed out Resolution through Process Optimization on DFN Packages
2020
[24] Process Optimization to Eliminate Automatic Alignment Failures on the Scalable Device
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[25] Addressing Package Voids on Extremely Small Leadframe Device
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[26] Resolution of Damaged Metallization on Highly Complex Semiconductor Device
2020
[27] The poetics of one's testimony
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[28] Die Attach Process Defect Mitigation through Design Improvement on Anvil Block Tooling
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[29] Pick and Place Process Defect Mitigation on Semiconductor BGA Device
2020
[30] Transitioning Semiconductor Companies Enabling Smart Environments and Integrated Ecosystems
2018
[31] Advances in Business and Management
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[32] Fabless Semiconductor Firms' Financial Performance Determinant Factors: Product Platform Efficiency and Technological Capability
2018
[33] Circuit Obfuscation and Oracle-guided Attacks: Who can Prevail?
GLSVLSI 2017 Proceedings of the on Great Lakes Symposium on VLSI 2017, 2017
[34] Cost-Benefit Analysis of Computer-Aided Technology Customization Projects
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[35] Nanotechnology for Microelectronics and Photonics
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[36] CYBER SUPPLY CHAIN SECURITY: CAN THE BACKDOOR BE CLOSED WITH TRUSTED DESIGN, MANUFACTURING AND SUPPLY
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[37] AU/ACSC/2016
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