A Top-Down Approach of Making Sn-3.5Ag Nanosolder Alloy by Swirl Method

Materials Sciences and Applications

ISSN Print: 2153-117X
ISSN Online: 2153-1188
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"A Top-Down Approach of Making Sn-3.5Ag Nanosolder Alloy by Swirl Method"
written by Hsin Jen Pan, Chao Yang Lin, Jung Hua Chou, Udit Surya Mohanty, Yuan Gee Lee,
published by Materials Sciences and Applications, Vol.2 No.9, 2011

has been cited by the following article(s):

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[2]	Synthesis and thermal properties of low melting temperature tin/indium (Sn/In) lead-free nanosolders and their melting behavior in a vapor flux
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[3]	Flame Synthesis of Mixed Tin‐Silver‐Copper Nanopowders and Conductive Coatings
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