• Testing of a Low-Cost Loop Heat Pipe Design ()
  Cosimo Buffone
  Journal of Electronics Cooling and Thermal Control Vol.4 No.1,  March 6, 2014
  DOI: 10.4236/jectc.2014.41004  6,000 Downloads   11,374 Views   Citations
  This article belongs to the Special Issue on

• Operating Characteristics of Multiple Evaporators and Multiple Condensers Loop Heat Pipe with Polytetrafluoroethylene Wicks ()
  Sho Okutani, Hosei Nagano, Shun Okazaki, Hiroyuki Ogawa, Hiroki Nagai
  Journal of Electronics Cooling and Thermal Control Vol.4 No.1,  March 6, 2014
  DOI: 10.4236/jectc.2014.41003  5,968 Downloads   9,244 Views   Citations
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• Heat Transfer Enhancement via Combined Wall and Triangular Rooted-Fin System ()
  Abdul Rahim A. Khaled, Abdullatif A. Gari
  Journal of Electronics Cooling and Thermal Control Vol.4 No.1,  March 6, 2014
  DOI: 10.4236/jectc.2014.41002  5,039 Downloads   7,475 Views   Citations
  This article belongs to the Special Issue on

• Two-Dimensional Numerical Investigation on Applicability of 45^。Heat Spreading Angle ()
  Yasushi Koito, Shoryu Okamoto, Toshio Tomimura
  Journal of Electronics Cooling and Thermal Control Vol.4 No.1,  March 6, 2014
  DOI: 10.4236/jectc.2014.41001  4,789 Downloads   7,654 Views   Citations
  This article belongs to the Special Issue on

• STAR CCM+ CFD Simulations of Enhanced Heat Transfer in High-Power Density Electronics Using Forced Air Heat Exchanger and Pumped Fluid Loop Cold Plate Fabricated from High Thermal Conductivity Materials ()
  Kevin R. Anderson, Matthew Devost, Watit Pakdee, Niveditha Krishnamoorthy
  Journal of Electronics Cooling and Thermal Control Vol.3 No.4,  December 17, 2013
  DOI: 10.4236/jectc.2013.34016  13,432 Downloads   21,499 Views   Citations
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• Numerical Analysis of Printed Circuit Board with Thermal Vias: Heat Transfer Characteristics under Nonisothermal Boundary Conditions ()
  Yasushi Koito, Yoshihiro Kubo, Toshio Tomimura
  Journal of Electronics Cooling and Thermal Control Vol.3 No.4,  December 6, 2013
  DOI: 10.4236/jectc.2013.34015  7,904 Downloads   12,380 Views   Citations
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• Effect of Non-Condensable Gas Leakage on Long Term Cooling Performance of Loop Thermosyphon ()
  Hiroyuki Toyoda, Yoshihiro Kondo
  Journal of Electronics Cooling and Thermal Control Vol.3 No.4,  December 6, 2013
  DOI: 10.4236/jectc.2013.34014  6,837 Downloads   10,392 Views   Citations
  This article belongs to the Special Issue on